Broadcom CEO says biggest hurdle in AI-fuelled tech growth is capital, not memory chips

ET Enterprise AI

Source published: Site published:

Original article · فارسی

Speaking at a panel discussion in Singapore on Monday, Tan said the company was overcoming wafer and memory shortages, but capital would remain its biggest constraint.
Speaking at a panel discussion in Singapore on Monday, Tan said the company was overcoming wafer and memory shortages, but capital would remain its biggest constraint.

Broadcom CEO Hock Tan said on Monday that capital will be the biggest constraint facing the company as AI development continues.

Speaking at a panel discussion in Singapore on Monday, Tan said the company was overcoming wafer and memory shortages, but capital would remain its biggest constraint.

He added that leading AI companies, including Anthropic and OpenAI, had demonstrated their ability to generate significant revenue from their latest AI models deployed in personal assistants.

  • Published On Oct 12, 2026 at 01:06 PM IST

Join the community of 2M+ industry professionals.

Subscribe to Newsletter to get latest insights & analysis in your inbox.